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	<title>3C 新報 &#187; Nexpaq</title>
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	<description>熱門流行 3C 資訊全在這！</description>
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		<title>模組化潮流正夯，Nexpaq 保護殼讓你自選多種額外功能</title>
		<link>http://3c.technews.tw/2015/04/30/nexpaq-the-first-truly-modular-smartphone-case/</link>
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		<pubDate>Thu, 30 Apr 2015 10:41:59 +0000</pubDate>
		<dc:creator><![CDATA[Blake]]></dc:creator>
				<category><![CDATA[Android 手機]]></category>
		<category><![CDATA[Apple]]></category>
		<category><![CDATA[iPhone]]></category>
		<category><![CDATA[Samsung]]></category>
		<category><![CDATA[周邊]]></category>
		<category><![CDATA[手機]]></category>
		<category><![CDATA[行動電源]]></category>
		<category><![CDATA[Galaxy S5]]></category>
		<category><![CDATA[Galaxy S6 edge]]></category>
		<category><![CDATA[iPhone 6]]></category>
		<category><![CDATA[Kickstarter]]></category>
		<category><![CDATA[Nexpaq]]></category>
		<category><![CDATA[模組化裝置]]></category>

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		<description><![CDATA[Google 的 Project Ara 還在樓梯上，但卻已經讓週邊廠商們開始動腦筋，如果連手機都能模組化，那 [&#8230;]]]></description>
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